MEMS Sensor
MEMS Sensor
MEMS List
| Type | Into sound way | shell | Dimension（mm) | sensitivity (±1/3) | SNR | Application |
| HBJV01 | Bottom | Ni shell、Au shell | 2.75*1.85*0.90 | -38dBv | 62.5db | Intelligent speaker and other voice controllers |
| HBJV02 | Top | Ni shell、Au shell | 2.75*1.85*0.90 | -42dBv | 59dB | Smart phones, headphones |
| HBJV03 | Bottom | Ni shell、Au shell | 2.75*1.85*0.90 | -38dBv | 62db | Smart phones, headphones |
| HBJV04 | Top | Ni shell、Au shell | 2.75*1.85*0.90 | -42dBv | 58dB | Smart phones, headphones |
| HBJV05 | Bottom | Ni shell、Au shell | 2.75*1.85*0.90 | -38dBv | 64db | Smart phones, headphones |
| HBJQ01 | Top | Ni shell、Au shell | 3.76*2.24*1.10 | -42dBv | 59db | Smart phones, headphones |
| HBYQ01 | Top | Ni shell、Au shell | 3.76*2.24*1.10 | -42dBv | 59db | Smart phones, headphones |
| HBYV01 | Top | Ni shell、Au shell | 2.75*1.85*0.90 | -42dBv | 59dB | Smart phones, headphones |
| HBYV02 | Bottom | Ni shell、Au shell | 2.75*1.85*0.90 | -38dBv | 62.5db | Smart phone、 headphones and other voice controllers |
| HBYV03 | Bottom | Ni shell、Au shell | 2.75*1.85*0.90 | -38dBv | 62db | Smart phone、 headphones and other voice controllers |
| HBYV04 | Bottom | Ni shell、Au shell | 2.75*1.85*0.90 | -38dBv | 64db | Note book carama module、Voice controllers、 security |
Previous：
DIP16
Next：
Rigid-flexible PCB